Sr. Packaging Engineer (Semiconductor)

Summary

Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio…

This is a short summary. The full description, and the application form, are on Semtech’s own careers page.

Location

IND - Hyderabad

Visa sponsorship

No

Relocation support

No

Salary

Not listed

Role family

Software Engineer (general)

First seen

17 Oct 2026 · Today

Last checked

17 Oct 2026